Amkor Technology, Inc. (AMKR)
Technology · Semiconductor Equipment & Materials · NasdaqGS
Amkor Technology, Inc. revenue & earnings — last 10 fiscal years
| Metric | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
|---|---|---|---|---|---|---|---|---|---|---|
| Revenue | $3.93B | $4.21B | $4.32B | $4.05B | $5.05B | $6.14B | $7.09B | $6.50B | $6.32B | $6.71B |
| Gross profit | $709.89M | $761.08M | $710.57M | $649.44M | $900.81M | $1.23B | $1.33B | $943.15M | $933.21M | $938.60M |
| Net income | $175.53M | $263.55M | $127.09M | $120.89M | $338.14M | $643.00M | $765.82M | $359.81M | $354.01M | $373.89M |
| Net margin | 4.5% | 6.3% | 2.9% | 3.0% | 6.7% | 10.5% | 10.8% | 5.5% | 5.6% | 5.6% |
Source: Amkor Technology, Inc. SEC filings (10-K). 18 years of history available in the interactive view.
Explore 18 years of Amkor Technology, Inc. financials — interactive
Full income statement, balance sheet and cash flow with CAGR and trend on every row, 48 quarters, valuation ratios, plain-English health checks, and Ask — our SEC-grounded research assistant.
Open the interactive view — freeOr start a 7-day free trial to track AMKR in your portfolio →
About Amkor Technology, Inc.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
Amkor Technology, Inc. — frequently asked questions
What is Amkor Technology, Inc.'s revenue?
Amkor Technology, Inc. (AMKR) reported revenue of $6.71B for fiscal year 2025, up 6.2% from the prior year, according to its SEC filings.
Is Amkor Technology, Inc. profitable?
Yes. AMKR earned net income of $373.89M in fiscal 2025, a net margin of 5.6%.
What is AMKR's P/E ratio?
Amkor Technology, Inc. trades at a price-to-earnings ratio of about 40.1 based on the latest data in our nightly-refreshed cache.
How fast is Amkor Technology, Inc. growing?
AMKR's revenue grew at roughly 5.8% per year over the last five fiscal years (compound annual growth rate), computed from SEC-filed statements.
Where does this data come from?
All figures are computed from Amkor Technology, Inc.'s official SEC filings (10-K and 10-Q), covering 18 years of history, refreshed nightly. stockportfolio.pro does not provide investment advice.